Design platform Figma is partnering with Google to add more AI features, the company announced on Thursday. While Figma had previously introduced AI app-building tools of its own, the new integration ...

Market Research Future forecasts 20% annual growth driven by tech advancements, sustainability, and adoption across aerospace ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

In today’s healthcare landscape, hospitals are under pressure to deliver better patient outcomes, improve financial performance, enhance safety and security, and streamline regulatory compliance—all ...

What if you could transform your creative projects into immersive, multidimensional masterpieces with just the right style? The world of 3D design has never been more exciting, offering a kaleidoscope ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...

CNC or 3D printing? Why not both? Hybrid approaches combine subtractive and additive manufacturing processes to deliver precise outputs at greater speeds. In this piece, we’ll break down the basics of ...

It’s the best way to anticipate the many secondary effects of change in an interconnected world. by Tima Bansal and Julian Birkinshaw Business has made huge strides in advancing economic and social ...

Lessons from cloud kitchens and other new business models. by Antonio Moreno For four decades advances in information technology have allowed companies to increasingly “unbundle” their operations and ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...