Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...

TSMC leads AI chip manufacturing with record 2024 results and 2nm/CoWoS growth. See why I rate the TSM stock a Buy.

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

The AOZ13058DI Type-C sink and AOZ15953DI Type-C source protection switches overcome risks of short circuits, enabling efficient, reliable, and safe Type-C EPR 3.1 designs up to 240W. The AOZ13058DI ...

KAOHSIUNG, Taiwan--(BUSINESS WIRE)--ASE Technology Holding Co., Ltd. (ASEH, TAIEX: 3711, NYSE: ASX), the leading provider of semiconductor packaging, test, and system assembly services, today ...

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D ...

ASU was recently chosen to become a flagship research and development facility for semiconductor prototyping and advanced packaging. With $1.2 billion from the CHIPS and Science Act, ASU has a chance ...

NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...