TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...
A medical device's package plays a key role in safely delivering treatment to patients. It must ensure the integrity of the device from the point of manufacture to the point of final use. In addition, ...
Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
Designing an efficient platform is crucial for any industrial process. This design process is known as process development, and it has become increasingly important in the pharmaceutical industry at ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
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