Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...
A new technical paper titled “A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers” was published by STMicroelectronics and DIEEI, Università di Catania. “This ...
The best-performing and most cost-effective power MOSFETs might well turn out to be those having no package at all. With power-MOSFET silicon now largely optimized, manufacturers are quickly ...
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