Is there anything more discouraging to the reverse engineer than to see a black blob of epoxy applied directly to a PCB? We think not, because that formless shape provides no clue as to what chip lies ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or is a chip that extends beyond the limits of a single die, may seem like hair-splitting semantics, but it ...