Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
Achieving efficiency in integrated circuit (IC) design while maintaining design quality is not just a goal, but a necessity. Designers constantly strive to strike a balance between ever-tightening ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
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