TSMC (NYSE:TSM) has entered a 10 year partnership with Amkor Technology to expand advanced semiconductor packaging and ...

Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

Advanced semiconductor packaging is revolutionizing the electronics industry, becoming pivotal as transistor scaling yields diminish. This shift is substantially driven by AI's demand for increased ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

As artificial intelligence pushes semiconductor performance to new limits, chipmakers are increasingly turning to advanced packaging to overcome challenges that traditional chip design alone can no ...

Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...

BE Semiconductor is a leading provider of assembly equipment for AI-optimized chips, benefiting directly from the AI boom.

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

India, July 6 -- The global semiconductor sector has entered a new growth phase powered by AI and cloud computing, along with increased demand for advanced memory solutions. While global players like ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.